{"id":24,"date":"2024-12-10T15:29:01","date_gmt":"2024-12-10T06:29:01","guid":{"rendered":"https:\/\/teikoku-taping.com\/service\/sample-service1\/"},"modified":"2025-07-10T18:57:33","modified_gmt":"2025-07-10T09:57:33","slug":"laminator","status":"publish","type":"service","link":"https:\/\/www.teikoku-taping.com\/en\/products\/laminator\/","title":{"rendered":"Fully Automatic Tape Laminator"},"content":{"rendered":"
\n

\uff1cVXL-1200X\uff1e300mmFully Automatic Vacuum Laminator<\/span><\/h3>\n
\n
\"300mm<\/div>\n
\n

Feature<\/span><\/h4>\n
    \n
  • Vacuum laminator equipment dedicated to 300 mm wafers.<\/span>\uff08Optional specifications<\/span>\/8 inches<\/span>\uff09<\/li>\n
  • Supports 1-carrier(F1) or 2-carrier(F2) systems.<\/span><\/li>\n
  • Two types of cutting methods<\/span>(V-notch cuttable<\/span>)- digital cutter blade method and Class 4\/CO2 laser cutting method<\/li>\n
  • All pasting parameters can be controlled by the recipe.<\/span>
    \nThe maximum attainable vacuum can be set up to 100pa.<\/span><\/li>\n
  • E84OHT.AGV compatible<\/span>\uff08Optional specifications<\/span>\uff09<\/li>\n
  • Thin wafers and wafers after various types of formation can also be handled.<\/span><\/li>\n
  • Finger support is also available.<\/span>\uff08Optional specifications<\/span>\uff09<\/li>\n
  • Please contact our representative for more information.<\/span><\/li>\n<\/ul>\n

    Specification<\/span><\/h4>\n
    \n\n\n\n\n\n\n
    Power<\/th>\nAC200-240V, Single Phase<\/td>\n<\/tr>\n
    Power Consumption<\/th>\n6KVA<\/td>\n<\/tr>\n
    Clean Air Pressure(CDA)<\/th>\n0.5 \u2013 0.6 MPa( Min Flow Rate:120NL\/min)<\/td>\n<\/tr>\n
    Vacuum<\/th>\n650-750mmHg(Min Flow Rate:60NL\/min)<\/td>\n<\/tr>\n
    Exhaust Duct Capacity<\/th>\n\u3010Normal Air\u30115.0m3\/min,40mmH20
    \n(100mm diameter SUS Flange duct connection)
    \n\u3010Contaminate Air\u30115.0m3\/min,40mmH100
    \n(100mm diameter SUS Flange duct connection)(Laser specification only<\/span>)<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n

    Equipment layout<\/span><\/h4>\n
    \n\n\n\n
    Dimension(WxDxHmm)<\/th>\n1500x2700x2350<\/td>\n<\/tr>\n
    Net Weight<\/th>\nAppx 1500Kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<\/div>\n<\/div>\n<\/div>\n
    \n

    \uff1cEXL2-1200X\uff1e300mmFully automatic wafer tape laminator<\/span><\/h3>\n
    \n
    \"300mm<\/div>\n
    \n

    Feature<\/span><\/h4>\n
      \n
    • Tape laminator equipment dedicated to 300 mm wafers.<\/span>\uff08Optional specifications<\/span>\/8 inches<\/span>\uff09<\/li>\n
    • It is compatible with either 1-cassette or 2-cassette system.<\/span><\/li>\n
    • Two types of cutting methods<\/span>(V-notch cuttable<\/span>)-Digital cutter blade method, <\/span>Class 4<\/span>\u30fbCO2 laser method<\/span>\uff08Optional specifications<\/span>\/Pre-cut\uff09<\/li>\n
    • All pasting parameters can be controlled by the recipe.<\/span><\/li>\n
    • E84OHT.AGV compatible<\/span>\uff08Optional specifications<\/span>\uff09<\/li>\n
    • Thin wafer, <\/span>Various types of post-forming wafers are also available.<\/span><\/li>\n
    • Finger support is also available.<\/span>\uff08Optional specifications<\/span>\uff09<\/li>\n
    • Please contact our representative for more information.<\/span><\/li>\n<\/ul>\n

      Specification<\/span><\/h4>\n
      \n\n\n\n\n\n\n
      Power<\/th>\nAC200-240V, Single Phase<\/td>\n<\/tr>\n
      Power Consumption<\/th>\n6KVA<\/td>\n<\/tr>\n
      Clean Air Pressure(CDA)<\/th>\n0.5 \u2013 0.6 MPa( Min Flow Rate:120NL\/min)<\/td>\n<\/tr>\n
      Vacuum<\/th>\n650 \u2013 750mmHg(Min Flow Rate:60NL\/min)<\/td>\n<\/tr>\n
      Exhaust Duct Capacity<\/th>\n\u3010Normal Air\u30115.0m3\/min,40mmH20
      \n(100mm diameter SUS Flange duct connection)
      \n\u3010Contaminate Air\u30115.0m3\/min,40mmH100
      \n(100mm diameter SUS Flange duct connection) (Laser specification only<\/span>)<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n

      Equipment layout<\/span><\/h4>\n
      \n\n\n\n
      Dimension(WxDxHmm)<\/th>\n1450x1800x2100<\/td>\n<\/tr>\n
      Net Weight<\/th>\nAppx 1250Kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<\/div>\n<\/div>\n<\/div>\n
      \n

      \uff1cDXL2-800X\uff1e200mmFully automatic wafer tape laminator<\/span><\/h3>\n
      \n
      \"200mm<\/div>\n
      \n

      Feature<\/span><\/h4>\n
        \n
      • Tape laminator equipment capable of handling up to 200 mm wafers.<\/span>\uff08Optional specifications<\/span>\/4,5,6\u30a4\u30f3\u30c1\uff09<\/li>\n
      • Two types of cutting methods<\/span>\uff08V-notch cuttable<\/span>\uff09
        \n-Digital cutter blade method, Class 4 CO2 laser method<\/span><\/li>\n
      • All pasting parameters can be controlled by the recipe.<\/span><\/li>\n
      • Thin wafers and wafers after various types of formation can also be handled.<\/span><\/li>\n
      • Finger support is also available.<\/span>\uff08Optional specifications<\/span>\uff09<\/li>\n
      • Please contact our representative for more information.<\/span><\/li>\n<\/ul>\n

        Specification<\/span><\/h4>\n
        \n\n\n\n\n\n\n
        Power<\/th>\nAC200-240V, Single Phase<\/td>\n<\/tr>\n
        Power Consumption<\/th>\n6KVA<\/td>\n<\/tr>\n
        Clean Air Pressure(CDA)<\/th>\n0.5 \u2013 0.6 MPa( Min Flow Rate:120NL\/min)<\/td>\n<\/tr>\n
        Vacuum<\/th>\n650-750mmHg(Min Flow Rate:60NL\/min)<\/td>\n<\/tr>\n
        Exhaust Duct Capacity<\/th>\n\u3010Normal Air\u30115.0m3\/min,40mmH20
        \n(100mm diameter SUS Flange duct connection)
        \n\u3010Contaminate Air\u30115.0m3\/min,40mmH100
        \n(100mm diameter SUS Flange duct connection) (Laser specification only<\/span>)<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n

        Equipment layout<\/span><\/h4>\n
        \n\n\n\n
        Dimension(WxDxHmm)<\/th>\n1250x1960x2230<\/td>\n<\/tr>\n
        Net Weight<\/th>\nAppx 750kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<\/div>\n<\/div>\n<\/div>\n

        <\/p>\n","protected":false},"excerpt":{"rendered":"\uff1cVXL-1200X\uff1e300mmFully Automatic Vacuum Laminator Feature Vacuum laminator equipment dedicated to 300 mm wafers.\uff08Optional specifications\/8 inches\uff09 Supports 1-carrier(F1) or 2-carrier(F2) systems. Two types of cutting methods(V-notch cuttable)- digital cutter blade method and Class 4\/CO2 laser cutting method All pasting parameters can be controlled by the recipe. The maximum attainable vacuum can be set up to 100pa. E84OHT.AGV compatible\uff08Optional specifications\uff09 Thin wafers and wafers after various types of formation can also be handled. Finger support is also available.\uff08Optional specifications\uff09 Please contact our representative for more information. Specification Power AC200-240V, Single Phase Power Consumption 6KVA Clean Air Pressure(CDA) 0.5 \u2013 0.6 MPa( Min Flow Rate:120NL\/min) Vacuum 650-750mmHg(Min Flow Rate:60NL\/min) Exhaust Duct Capacity \u3010Normal […]","protected":false},"featured_media":1222,"template":"","service_category":[8],"class_list":["post-24","service","type-service","status-publish","has-post-thumbnail","hentry","service_category-laminator"],"_links":{"self":[{"href":"https:\/\/www.teikoku-taping.com\/en\/wp-json\/wp\/v2\/service\/24","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.teikoku-taping.com\/en\/wp-json\/wp\/v2\/service"}],"about":[{"href":"https:\/\/www.teikoku-taping.com\/en\/wp-json\/wp\/v2\/types\/service"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.teikoku-taping.com\/en\/wp-json\/wp\/v2\/media\/1222"}],"wp:attachment":[{"href":"https:\/\/www.teikoku-taping.com\/en\/wp-json\/wp\/v2\/media?parent=24"}],"wp:term":[{"taxonomy":"service_category","embeddable":true,"href":"https:\/\/www.teikoku-taping.com\/en\/wp-json\/wp\/v2\/service_category?post=24"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}