＜EXM-1200X＞300mm Fully automatic wafer tape mounter
Feature
- Tape mounter system for 300mm formed wafer multi-process（Optional specifications/8 inches）
- Mounting tape is available in roll tape（Standard specification）and pre-cut tape（Optional specifications）.
- All parameters for attaching wafers to the frame can be controlled by the recipe.
- Basic support, capable of transporting ultra-thin wafers and wafers with large warpage.
- In-line LED UV irradiation and protective tape removal are also possible.（Optional specifications）
- Please contact our representative for more information.
Specification
| Power | AC200-240V, Single Phase |
|---|---|
| Power Consumption | 6KVA |
| Clean Air Pressure(CDA) | 0.5 – 0.6 MPa( Min Flow Rate:120NL/min) |
| Vacuum | 650-750mmHg(Min Flow Rate:60NL/min) |
| Exhaust Duct Capacity | 【Normal Air】5.0m3/min, 40mmH20 (100mm diameter SUS Flange duct connection) |
Equipment layout
| Dimension(WxDxHmm) | 2700x2620x2250 |
|---|---|
| Net Weight | Appx 2000kg |
＜CXM-800/1200＞300mm Fully automatic wafer mounter
Feature
- Tape mounter equipment dedicated for 300mm formed wafers.（4,5,6,8,12 inches possible）
- It can be used for ultra-thin wafers and wafers with large warpage.
- Compatible with roll-cut tape（Standard specification） and precut tape（Optional specifications）.
- Other options（Barcode print・reader, OCR, etc.） are also available.
- Please contact our representative for more information.
Specification
| Power | AC200-240V, Single Phase |
|---|---|
| Power Consumption | 6KVA |
| Clean Air Pressure(CDA) | 0.5-0.6 MPa(Min Flow Rate:120NL/min) |
| Vacuum | 650-750mmHg(Min Flow Rate:60NL/min) |
Equipment layout
| Dimension(WxDxHmm) | 2000x2000x2200 |
|---|---|
| Net Weight | Appx 1600Kg |
