Fully automatic tape remover

Tape remover device dedicated to 300 mm wafers.（Optional specifications/8 inches）
Supports 1-carrier or 2-carrier systems.
All parameters during peeling can be controlled by the recipe.
There is also a peeling method using LED UV irradiation.（Optional specifications）
Ultra-thin wafers can also be processed by using ultra-thin carriers and wafers.（Optional specifications）
Peel-off method/ Adhesive tape（standard specification）and heat seal（Optional specifications）are also available.
Finger support is also available.（Optional specifications）
Please contact our representative for more information.

Power	AC200-240V, Single Phase
Power Consumption	6KVA
Clean Air Pressure(CDA)	0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum	650-750mmHg(Min Flow Rate:60NL/min)
Exhaust Duct Capacity	【Normal Air】5.0m3/min,40mmH20 （100mm diameter SUS Flange duct connection）

Dimension(WxDxHmm)	1600x1400x2100
Net Weight	Appx 800Kg

Tape remover equipment capable of handling up to 200 mm wafers.（Standard specification/4,5,6 inchs、Optional specifications/8 inches）
All peeling parameters can be controlled by recipe.
Ultra-thin wafers can also be processed by using ultra-thin carriers and wafers.（Optional specifications）
Finger support is also available.（Optional specifications）
Please contact our representative for more information.

Power	AC200-240V, Single Phase
Power Consumption	6KVA
Clean Air Pressure(CDA)	0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum	650-750mmHg(Min Flow Rate:60NL/min)
Exhaust Duct Capacity	【Normal Air】5.0m3/min,40mmH20 (100mm diameter SUS Flange duct connection)

Dimension(WxDxHmm)	1350x1350x2230
Net Weight	Appx 710Kg