Features
| ■UV irradiation equipment for dicing tape. For wafers up to 300mm. | ■All parameters important for UV irradiation an be controlled in the recipe. | ■Settings can be quickly changed to process different wafar/frame sizes. | ■Longer-lasting UV lamp realized by TTS’s proprietary UV technology. | ■Other optional features are available. |
Specifications
| Power | AC200-240V,Single Phase |
|---|---|
| Power Consumption | 3KVA[with UV] |
| Clean Air Pressure(CDA) | 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min) |
| Vacuum | 650 – 750mmHg ( Min Flow Rate:60NL/min) |
| Nitrogen(For UV) | 0.2 – 0.4 MPa ( Min Flow Rate:20NL/min) |
| Exhaust Duct Capacity | 1.0m3/min,10mmH20(100mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension(WxDxHmm) | 1350×1250×1800 |
|---|---|
| Net Weight | Appx 500Kg |
