Laminatos

Fully-automatic tape laminators and vacuum laminators

<VXL-1200X> 300mm Fully-automatic Vacuum Laminator

Features

■A vacuum laminator for wafers of 300mm.(optionally available:8inches) ■Single and double cassette loading ■Two cutting methods (including V-notch cutting):digital cutter blade method,Pre-Cur method ■All parameters important for taping can be controlled in the recipe.
Equipment can be configured with ultimate vacuum at 100Pa.
■Can be used with thinner wafers.(such as shaped or reworked wafers) ■Other optional features are available.

Specifications

Power AC200-240V,Single Phase
Power Consumption 3KVA
Clean Air Pressure(CDA) 0.5 – 0.6 MPa
( Min Flow Rate:120NL/min)
Vacuum 650 – 750mmHg
( Min Flow Rate:60NL/min)
Exhaust Duct Capacity 5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection)

System Arrangement

Dimension(WxDxHmm) 1450×2000×2400
Net Weight Appx 1400Kg

<EXL2-1200X> 300mm Fully-Automatic Wafer Tape Laminator

Features

               
■A tape laminator for wafers up to 300mm(optionally available:8inches) ■Single and double cassette loading ■Two cutting methods (V-notch cutting):digital cutter blade method and class 4 CO2 laser method. ■All parameters important for taping can be controlled in the recipe.■Can be used with thinner wafers.(such as shaped or reworked wafers) ■Other optional features are available.

Specifications

Power AC200-240V,Single Phase
Power Consumption 3KVA
Clean Air Pressure(CDA) 0.5 – 0.6 MPa
( Min Flow Rate:120NL/min)
Vacuum 650 – 750mmHg
( Min Flow Rate:60NL/min)
Exhaust Duct Capacity 5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection)

System Arrangement

Dimension(WxDxHmm) 1350×1750×2100
Net Weight Appx 1200Kg

<DXL2-800X> 200mm Fully-automatic Wafer Taper Laminator

Features

■A tape laminator for wafers up to 200mm(8inches)(4-,5-,6-,and 8-inch) ■Two cutting methods (V-notch cutting):digital cutter blade method and class 4 CO2 laser method ■All parameters important for taping can be controlled in the recipe. ■Can be used with thinner wafers.(such as shaped or reworked wafers) ■Other optional features are available.

Specifications

Power AC200-240V,Single Phase
Power Consumption 3KVA
Clean Air Pressure(CDA) 0.5 – 0.6 MPa
( Min Flow Rate:120NL/min)
Vacuum 650 – 750mmHg
( Min Flow Rate:60NL/min)
Exhaust Duct Capacity 5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection)

System Arrangement

Dimension(WxDxHmm) 1250×1390×1850
Net Weight Appx 500Kg

<CPL-300CS> Fully Automatic Panel Laminator

Features

■Fully Automatic Laminator for Panel Size (Applicable Panel size, please contact to Teikoku Taping System) ■Cutting by TTS Digital Cutter Blade will follow exact panel size. ■Applicable for TTS Inline Pre-Cut Tape Lamination ■Other optional features are available (Tape Remove Function、Inline LED UV Irradiation、Vacuum Lamination etc..)

Specifications

Power AC200-240V,Single Phase
Power Consumption 3KVA
Clean Air Pressure(CDA) 0.5 – 0.6 MPa
( Min Flow Rate:120NL/min)
Vacuum 650 – 750mmHg
( Min Flow Rate:60NL/min)
Exhaust Duct Capacity 5.0m3/min,40mmH20(100mm diameter SUS Flange duct connection)

System Arrangement

Dimension(WxDxHmm) 1800×1200×1900
Net Weight Appx 1200Kg

半自動もあります

半自動もあります