Fully Automatic Tape Laminator

<VXL-1200X>300mmFully Automatic Vacuum Laminator

300mm 全自動バキュームラミネーターの外観

Feature

  • Vacuum laminator equipment dedicated to 300 mm wafers.Optional specifications/8 inches
  • Supports 1-carrier(F1) or 2-carrier(F2) systems.
  • Two types of cutting methods(V-notch cuttable)- digital cutter blade method and Class 4/CO2 laser cutting method
  • All pasting parameters can be controlled by the recipe.
    The maximum attainable vacuum can be set up to 100pa.
  • E84OHT.AGV compatibleOptional specifications
  • Thin wafers and wafers after various types of formation can also be handled.
  • Finger support is also available.Optional specifications
  • Please contact our representative for more information.

Specification

Power AC200-240V, Single Phase
Power Consumption 6KVA
Clean Air Pressure(CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum 650-750mmHg(Min Flow Rate:60NL/min)
Exhaust Duct Capacity 【Normal Air】5.0m3/min,40mmH20
(100mm diameter SUS Flange duct connection)
【Contaminate Air】5.0m3/min,40mmH100
(100mm diameter SUS Flange duct connection)(Laser specification only)

Equipment layout

Dimension(WxDxHmm) 1500x2700x2350
Net Weight Appx 1500Kg

<EXL2-1200X>300mmFully automatic wafer tape laminator

300mm 全自動ウエハーテープラミネーター

Feature

  • Tape laminator equipment dedicated to 300 mm wafers.Optional specifications/8 inches
  • It is compatible with either 1-cassette or 2-cassette system.
  • Two types of cutting methods(V-notch cuttable)-Digital cutter blade method, Class 4CO2 laser methodOptional specifications/Pre-cut)
  • All pasting parameters can be controlled by the recipe.
  • E84OHT.AGV compatibleOptional specifications
  • Thin wafer, Various types of post-forming wafers are also available.
  • Finger support is also available.Optional specifications
  • Please contact our representative for more information.

Specification

Power AC200-240V, Single Phase
Power Consumption 6KVA
Clean Air Pressure(CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum 650 – 750mmHg(Min Flow Rate:60NL/min)
Exhaust Duct Capacity 【Normal Air】5.0m3/min,40mmH20
(100mm diameter SUS Flange duct connection)
【Contaminate Air】5.0m3/min,40mmH100
(100mm diameter SUS Flange duct connection) (Laser specification only)

Equipment layout

Dimension(WxDxHmm) 1450x1800x2100
Net Weight Appx 1250Kg

<DXL2-800X>200mmFully automatic wafer tape laminator

200mm 全自動ウエハーテープラミネーター

Feature

  • Tape laminator equipment capable of handling up to 200 mm wafers.Optional specifications/4,5,6インチ)
  • Two types of cutting methodsV-notch cuttable
    -Digital cutter blade method, Class 4 CO2 laser method
  • All pasting parameters can be controlled by the recipe.
  • Thin wafers and wafers after various types of formation can also be handled.
  • Finger support is also available.Optional specifications
  • Please contact our representative for more information.

Specification

Power AC200-240V, Single Phase
Power Consumption 6KVA
Clean Air Pressure(CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min)
Vacuum 650-750mmHg(Min Flow Rate:60NL/min)
Exhaust Duct Capacity 【Normal Air】5.0m3/min,40mmH20
(100mm diameter SUS Flange duct connection)
【Contaminate Air】5.0m3/min,40mmH100
(100mm diameter SUS Flange duct connection) (Laser specification only)

Equipment layout

Dimension(WxDxHmm) 1250x1960x2230
Net Weight Appx 750kg