<VXL-1200X>300mmFully Automatic Vacuum Laminator

Feature
- Vacuum laminator equipment dedicated to 300 mm wafers.(Optional specifications/8 inches)
- Supports 1-carrier(F1) or 2-carrier(F2) systems.
- Two types of cutting methods(V-notch cuttable)- digital cutter blade method and Class 4/CO2 laser cutting method
- All pasting parameters can be controlled by the recipe.
The maximum attainable vacuum can be set up to 100pa. - E84OHT.AGV compatible(Optional specifications)
- Thin wafers and wafers after various types of formation can also be handled.
- Finger support is also available.(Optional specifications)
- Please contact our representative for more information.
Specification
Power | AC200-240V, Single Phase |
---|---|
Power Consumption | 6KVA |
Clean Air Pressure(CDA) | 0.5 – 0.6 MPa( Min Flow Rate:120NL/min) |
Vacuum | 650-750mmHg(Min Flow Rate:60NL/min) |
Exhaust Duct Capacity | 【Normal Air】5.0m3/min,40mmH20 (100mm diameter SUS Flange duct connection) 【Contaminate Air】5.0m3/min,40mmH100 (100mm diameter SUS Flange duct connection)(Laser specification only) |
Equipment layout
Dimension(WxDxHmm) | 1500x2700x2350 |
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Net Weight | Appx 1500Kg |
<EXL2-1200X>300mmFully automatic wafer tape laminator

Feature
- Tape laminator equipment dedicated to 300 mm wafers.(Optional specifications/8 inches)
- It is compatible with either 1-cassette or 2-cassette system.
- Two types of cutting methods(V-notch cuttable)-Digital cutter blade method, Class 4・CO2 laser method(Optional specifications/Pre-cut)
- All pasting parameters can be controlled by the recipe.
- E84OHT.AGV compatible(Optional specifications)
- Thin wafer, Various types of post-forming wafers are also available.
- Finger support is also available.(Optional specifications)
- Please contact our representative for more information.
Specification
Power | AC200-240V, Single Phase |
---|---|
Power Consumption | 6KVA |
Clean Air Pressure(CDA) | 0.5 – 0.6 MPa( Min Flow Rate:120NL/min) |
Vacuum | 650 – 750mmHg(Min Flow Rate:60NL/min) |
Exhaust Duct Capacity | 【Normal Air】5.0m3/min,40mmH20 (100mm diameter SUS Flange duct connection) 【Contaminate Air】5.0m3/min,40mmH100 (100mm diameter SUS Flange duct connection) (Laser specification only) |
Equipment layout
Dimension(WxDxHmm) | 1450x1800x2100 |
---|---|
Net Weight | Appx 1250Kg |
<DXL2-800X>200mmFully automatic wafer tape laminator

Feature
- Tape laminator equipment capable of handling up to 200 mm wafers.(Optional specifications/4,5,6インチ)
- Two types of cutting methods(V-notch cuttable)
-Digital cutter blade method, Class 4 CO2 laser method - All pasting parameters can be controlled by the recipe.
- Thin wafers and wafers after various types of formation can also be handled.
- Finger support is also available.(Optional specifications)
- Please contact our representative for more information.
Specification
Power | AC200-240V, Single Phase |
---|---|
Power Consumption | 6KVA |
Clean Air Pressure(CDA) | 0.5 – 0.6 MPa( Min Flow Rate:120NL/min) |
Vacuum | 650-750mmHg(Min Flow Rate:60NL/min) |
Exhaust Duct Capacity | 【Normal Air】5.0m3/min,40mmH20 (100mm diameter SUS Flange duct connection) 【Contaminate Air】5.0m3/min,40mmH100 (100mm diameter SUS Flange duct connection) (Laser specification only) |
Equipment layout
Dimension(WxDxHmm) | 1250x1960x2230 |
---|---|
Net Weight | Appx 750kg |