WHAT'S NEW

【Exhibit】SEMICON Japan 2023 – Dec 13-15, 2023

11/15/2023

Thank you for visiting Teikoku Taping System Website!

 

We will be exhibiting at SEMICON Japan 2023 in Tokyo, JAPAN.

 

Please visit to our distributor’s booth during exhibition at Tokyo Bigsight in Tokyo, JAPAN.

 

We look forward to meeting with you.

 

【Exhibition Details】

Exhibition SEMICON® JAPAN 2023
Duration 2023/12/13(Wed)~2023/12/15(Fri)10:00~17:00
Location Tokyo Bigsite (Advanced Packaging and Chiplet Summit Area)
Booth Number 1135

https://www.semiconjapan.org/jp

PulseForge, Inc. Agrees to Strategic Integration Partnership with Teikoku Taping System Co., Ltd.

09/04/2023

[Austin, TX- August 30, 2023] – PulseForge, Inc., a leading innovator in equipment and materials for semiconductor debonding, micro-LED transfer, curing, sintering, and soldering technologies, has established a strategic integration partnership with Teikoku Taping System (TTS). Together, they will integrate the PulseForge photonic debonding module into a state-of-the-art, fully-automated tool tailored for the semiconductor industry. By integrating this advanced module with TTS’s fully-automated tool platform, both PulseForge and TTS aim to provide semiconductor manufacturers with a comprehensive and efficient solution.

 

Photonic debonding stands out as a highly cost-effective alternative compared to existing industry methods. Its capability to handle warped wafers without the need for costly and time-consuming warpage adjustment hardware makes it an efficient and economical solution, and it can process wafers at a substantially higher throughput than other industry alternatives. A key breakthrough lies in its innovative use of a reusable inorganic release layer, ensuring an improved yield, and a clean and ash-free debonding process. By collaborating with TTS, PulseForge aims to establish a strong presence in Japan and extend its advanced back-end processing solutions to the region.

TTS will be building the first fully-automated demo tool with the PulseForge module integrated in it. This tool will also include TTS’s detaping solution to remove the adhesive from the wafer post debond. The tool will be showcased at PulseForge’s Austin, Texas facility, allowing customers to witness its capabilities firsthand. Additionally, TTS plans to utilize the tool for debonding services, where customers can evaluate this tool on a pilot scale.

 

TTS is a wholly-owned subsidiary of the highly-esteemed Japanese Nippon Kayaku Group, Co. Ltd. Adding photonic debonding to their product portfolio presents an exciting opportunity for both entities to capitalize on their individual strengths and to leverage their respective capabilities to explore new vertical markets and expand their client reach. TTS customizes tools to meet customer requirements using a modular approach, so PulseForge can be integrated with existing wafer mounting and de-taping expertise.

 

“As we explore potential engagement strategies, we are enthusiastic about building a mutually beneficial partnership with TTS that expands market reach and applications for our technologies” stated Jonathan Gibson, CEO of PulseForge, Inc.

“We are delighted to have a wonderful relationship and to form a strategic partnership with PFI. We are excited to be able to offer this advanced process to the temporary debonding area through the integration of PFI and TTS technologies.“ said Hochoong Lee, Executive Officer, GM at Global Sales & Business Development of Teikoku Taping System Co., Ltd.

 

About PulseForge, Inc

PulseForge, Inc. utilizes applied energy in a precise and targeted manner to enable innovation in industrial manufacturing. Our expertise and tools empower our customers to explore novel materials and manufacturing methodologies, driving dynamic and efficient production at an industrial scale. Learn more at www.pulseforge.com

 

About Teikoku Taping System Co., Ltd.

TTS, headquartered in Tokai-City, Aichi, Japan, is a specialized company that excels in the development, manufacturing, sales, and support of semiconductor backend manufacturing equipment.  TTS is a wholly owned subsidiary of Nippon Kayaku Group, Co. Ltd. which was founded in 1916 and boasts over 5,700 employees. Their diverse product portfolio encompasses tape lamination, tape removal, wafer mounting, and more, giving them a strong presence in the global niche markets.

 

For media inquiries, please contact:

 

PulseForge, Inc.
400 Parker Dr, Suite 1110 Austin, TX
Phone: +1 512.491.9500 ext. 245
Email: jaimie.mauvais@pulseforge.com; pf.sales@pulseforge.com
Website: https://pulseforge.com/

 

Teikoku Taping System, Co., Ltd.
43-1 Harabuto Kagiyamachi Tokai-city, Aichi, Japan, 477-0032
Phone: +81-562-33-7172
Email: hc-lee@teikoku-taping.com
Website:http://www.teikoku-taping.com/en/

Change Parents Company and Renewal for Website

07/06/2021

Dear Valued Customers,

 

Thank you for visiting to our website.

 

We are please to announce that TTS and Nippon Kayaku has signed for an agreement to acquire TTS on Feb 5th , 2021. From April 1st, TTS is officially consolidated subsidiary of  Nippon Kayaku.

 

Nippon Kayaku Co., Ltd.

https://www.nipponkayaku.co.jp/english/

 

Announcement

https://ssl4.eir-parts.net/doc/4272/announcement5/66791/00.pdf

 

According to this agreement, TTS Website has been renewed.

 

We look forward to working with you!!

 

【Exhibit】SEMICON Taiwan 2019 – Sep 18-20, 2019

09/17/2019

Thank you for visiting Teikoku Taping System Website!

 

We will be exhibiting at SEMICON Taiwan 2019 in Taipei, Taiwan R.O.C..

 

Please visit to our distributor’s booth during exhibition in Taipei.

 

We look forward to meeting with you in Taipei!

 

SEMICON Taiwan 2019

http://www.semicontaiwan.org/en/

 

2018/9/18-20

TaiNEX1

Jipal Corporation   4th Floor – M0348

【Exhibit】IMAPS – 15th International Conference and Exhibition on Devise Packaging

02/20/2019

Thank you for visiting Teikoku Taping System Website!

 

We will be exhibiting at IMAPS – 13th International Conference and Exhibition on Devise Packaging at Fountain Hills, AZ on 3/4-7/2019.

 

We are looking forward to your visit to our booth during exhibition!!

 

IMAPS – 15th International Conference and Exhibition on Devise Packaging

http://www.imaps.org/devicepackaging/

 

2019/3/4-7
Fountain Hills, AZ, United States
WekoPa Resort and Casino
10438 NORTH FORT MCDOWELL ROAD  SCOTTSDALE/FOUNTAIN HILLS, AZ 85264
Teikoku Taping System, Inc.  Booth# 6

SEMICON Taiwan 2018 in Taipei, Sep 5-7, 2018

08/24/2018

Thank you for visiting Teikoku Taping System Website!

 

We will be exhibiting at SEMICON Taiwan 2018 in Taipei, Taiwan R.O.C..

 

Please visit to our distributor’s booth during exhibition in Taipei.

 

We look forward to meeting with you in Taipei!

 

SEMICON Taiwan 2018

http://www.semicontaiwan.org/en/

 

2018/9/5-7

Taipei Nangang Exhibition Center

Jipal Corporation   4th Floor – L116

Exhibit at IMAPS 2017-Raleigh (2017/10/10-11)

10/09/2017

Thank you for visiting Teikoku Taping System Website!

 

We will be exhibiting at IMAPS 2017 at Raleigh, NC on 10/10-11.

 

Please visit to our booth during exhibition.

 

IMAPS 2017 – Raleigh

http://www.imaps.org/imaps2017/

 

 

2017/10/10-11

Raleigh Convention Center

500 S Salisbury St, Raleigh, NC, 27601, United States

 

Teikoku Taping System, Inc. #434

Exhibit at MEMS Manufacturing 2017 (2017/8/2-8/3)

08/01/2017

Thank you for visiting Teikoku Taping System Website!

 

We will be exhibiting at MEMS Manufacturing 2017 at Santa Clara, CA, USA on 8/2-8/3.

 

Please visit to our booth during exhibition. We look forward to meeting you at our booth!

 

MEMS Manufacturing 2017

http://www.memsmanufacturing.com/

 

2017/8/2-8/3
Biltmore Hotel & Suites
2151 Laurelwood Road
Santa Clara, CA 95054
Teikoku Taping System, Inc.

Exhibit at ECTC 2017 (2017/5/31-6/1)

05/30/2017

Thank you for visiting Teikoku Taping System Website!

 

We will be exhibiting at ECTC(Electronic Components and Technology Conference) at Orlando FL, USA on 5/31-6/1.

 

Please visit to our booth during exhibition. We look forward to meeting you at our booth!

 

ECTC 2017

http://www.ectc.net/

 

2017/5/31-6/1
Orlando, FL, United States
Walt Disney World Swan and Dolphin
Teikoku Taping System, Inc.  Booth# 104

Exhibit at CS ManTech (2017/5/22-25)

05/02/2017

Thank you for visiting Teikoku Taping System Website!

 

We will be exhibiting at CS ManTech at Indian Wells, CA, USA on 5/22-25.

 

Please visit to our booth during exhibition.

 

We look forward to meeting you at our booth!

 

CS ManTech

http://csmantech.org/

 

2017/5/22-25
Indian Wells, CA, United States
Hyatt Regency Indian Wells Resort & Spa
Teikoku Taping System, Inc.  Booth# 311