Our strengths revolve around “taping”, that is, lamination and removal of protective tape and technologies associated with such processes, as well as technologies related to handling of wafers.
We always keep up with the newest materials and technologies used in semiconductor fabrication to provide one-step-ahead turnkey solutions.
With our proprietary technologies, we help maximize the operation of your semiconductor fabrication factory. Our proprietary technologies are compatible with new film materials, state-of-the-art packaging technologies, and thinner wafers that may come in different profiles.
At TTS, we are committed to providing excellent customer care and services to ensure your satisfaction. From assisting you to find the right product for your needs and budget to after-sale services to ensure the optimal operation of our system at your facility, we are always here to help you.
2019.02.20 【Exhibit】IMAPS – 15th International Conf･･･
2018.08.24 SEMICON Taiwan 2018 in Taipei, Sep 5-7, ･･･
2017.10.09 Exhibit at IMAPS 2017-Raleigh (2017/10/1･･･
2017.08.01 Exhibit at MEMS Manufacturing 2017 (201･･･
2017.05.30 Exhibit at ECTC 2017 (2017/5/31-6/1)
2017.05.02 Exhibit at CS ManTech (2017/5/22-25)
2017.03.07 Exhibition at SEMICON China 2017 (Mar 14･･･
2017.02.28 Exhibit at IMAPS - 13th Internatinal Con･･･
2016.10.17 Exhibition at IWLPC 2016 (Oct. 18-20)
2016.10.11 Exhibition at IMAPS Pasadena 2016 (Oct. ･･･